
Molybdenum-copper alloy is widely used in key components such as packaging heat sinks, substrates and heat sinks for high-power semiconductor devices. However, due to the complex surface chemistry and low surface activity of the alloy, it is prone to problems such as insufficient interfacial bonding, poor electrical contact performance, and unstable corrosion resistance when directly used in packaging applications. Therefore, electroplating and surface treatment processes have become a key link to improve their packaging performance. There are two main problems…