Molybdenum-copper alloy has a wide range of application prospects in the field of high-power electronic packaging due to their high thermal conductivity and adjustable coefficient of thermal expansion. By optimizing the composition ratio, manufacturing process, and microstructure, better thermal conductivity and more precise thermal expansion matching can be achieved, providing a more reliable heat dissipation solution for electronic devices.
Research focus on the matching of thermal conductivity and thermal expansion
The core advantage of molybdenum-copper alloy in electronic packaging lies in the coordinated optimization of its thermal conductivity and thermal expansion coefficient. Thermal management is a key issue in high-power electronics, where materials need to have efficient thermal conductivity to reduce device temperature escalation, while also matching the expansion characteristics of chips and other packaging materials to reduce the risk of failure due to thermal stress.
(1) Thermal conductivity optimization research
The thermal conductivity of molybdenum copper depends on the ratio of molybdenum to copper, the density of the material, and the manufacturing process. Research on optimizing thermal conductivity focuses on the following aspects:
Composition optimization: Increasing the copper content can improve the thermal conductivity, but it needs to balance mechanical strength and high temperature resistance.
Manufacturing process improvement: Adopt high-density powder metallurgy process or liquid phase sintering technology to reduce microporosity and improve thermal conductivity.
Interfacial thermal resistance control: By refining the alloy phase structure, the thermal resistance at the molybdenum-copper phase interface is reduced, and the overall heat conduction ability is improved.
(2) Research on thermal expansion matching performance
To ensure that molybdenum copper can be matched to packaged chips and other materials, research focuses include:
Precise adjustment of CTE: By optimizing the molybdenum-copper ratio, the CTE is matched with chip materials such as Si, GaN, and GaAs, reducing thermal cycling stress.
Microstructure optimization: through the uniform distribution of molybdenum phase and copper phase, the expansion uniformity of the material is improved and the local stress concentration is reduced.
Temperature stability study: Analyze the CTE changes of molybdenum copper in different temperature environments to ensure the stability of long-term use.
