With the development of integrated circuits to high density, miniaturization and high performance, 3D packaging…

Molybdenum-copper alloy is a metal composite material with high thermal conductivity and low coefficient of…

With the development of electronic devices in the direction of miniaturization, high integration and high…

As a high-performance electronic packaging material, molybdenum-copper alloy (MoCu) surface treatment technology plays a decisive…

With the continuous development of integrated circuit technology, the traditional two-dimensional planar packaging method has…

In practice, the hermeticity and long-term reliability of molybdenum-copper packages still face many challenges, especially…

The manufacture of ultra-thin molybdenum copper heat sinks must not only maintain the compactness and…

Molybdenum-copper alloy is widely used in key components such as packaging heat sinks, substrates and…

With the rapid development of semiconductor devices in the direction of high power, high frequency…

Molybdenum-copper alloy (Mo-Cu) is a material composed of molybdenum with high melting point and high…